Title:
GRINDING/ELECTROLYSIS COMBINED MULTI-WIRE-SLICING PROCESSING METHOD FOR SILICON WAFERS
Document Type and Number:
WIPO Patent Application WO/2011/124044
Kind Code:
A1
Abstract:
A grinding/electrolysis combined multi-wire-slicing processing method for silicon wafers includes the following steps: first, with a metal slicing wire (10) provided on a multi-wire-slicing machine serving as cathode, a silicon rod or a silicon ingot (1) (anode) is processed by grinding/electrolysis combined multi-wire-slicing through application of a voltage; second, during said processing, the metal slicing wire (10) and the silicon rod or a silicon ingot (1) are connected with a low-voltage continuous or pulsed direct current power supply (9); third, an electrolytic liquid is sprayed into the cutting area to ensure cooling and anode erosion. The method reduces macroscopic cutting force and enables a grinding/electrolysis combined multi-wire-slicing processing method for large size ultra-thin silicon wafers.
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Inventors:
WANG, Wei (No. 15 Bldg, 29 Yudao St. Baixi, Nanjing Jiangsu 6, 210016, CN)
汪炜 (中国江苏省南京市白下区御道街29号15号楼, Jiangsu 6, 210016, CN)
汪炜 (中国江苏省南京市白下区御道街29号15号楼, Jiangsu 6, 210016, CN)
Application Number:
CN2010/075147
Publication Date:
October 13, 2011
Filing Date:
July 14, 2010
Export Citation:
Assignee:
NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS (29 Yudao St, BaixiaNanjing, Jiangsu 6, 210016, CN)
南京航空航天大学 (中国江苏省南京市白下区御道街29号, Jiangsu 6, 210016, CN)
WANG, Wei (No. 15 Bldg, 29 Yudao St. Baixi, Nanjing Jiangsu 6, 210016, CN)
南京航空航天大学 (中国江苏省南京市白下区御道街29号, Jiangsu 6, 210016, CN)
WANG, Wei (No. 15 Bldg, 29 Yudao St. Baixi, Nanjing Jiangsu 6, 210016, CN)
International Classes:
B23H5/08; B23H7/02
Attorney, Agent or Firm:
NANJING JINGWEI PATENT & TRADEMARK AGENCY CO., LTD (12th Fl.-B, No. 179 Zhongshan Road Gulo, Nanjing Jiangsu 5, 210005, CN)
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