COMBINED PACKAGING SYSTEM FOR PUNCTURE OUTFIT

WIPO Patent Application WO/2018/219315

A1

Disclosed is a combined packaging system for a puncture outfit, the combined packaging system comprising a first housing (530), a second housing (550) and a cover (510), wherein the first housing (530) comprises a planar lip (535), a first connecting lip (537) and a first shell (536) extending therebetween; the planar lip (535) includes an outer lip edge (534), an inner lip edge (532) and a planar wall (533) extending therebetween, and an open packaging opening (531) is defined by the inner lip edge (532); an open connecting hole (538) is defined by the first connecting lip (537); the second housing (550) includes a second connecting lip (555), a sealed distal end (557) and a second shell (556) extending therebetween; the first connecting lip (537) and the second connecting lip (555) are welded to form a first sealed side; the first housing (530) and the second housing (550) are connected by the first sealed side to form an integral seamless housing, and a seamless cavity comprising an end opening is defined by the seamless housing; and the cover (510) and the planar wall (533) are welded to form a second sealed side, and the seamless housing and the cover (510) are connected by the second sealed side to form an integral sealed cavity.

ZHU MOSHU (CN)

PCT/CN2018/089180

December 06, 2018

May 31, 2018

Click for automatic bibliography generation  

5R MED TECH CHENGDU CO LTD (CN)

A61B17/34; B65D75/36

CN107416351A	2017-12-01
CN207015855U	2018-02-16
CN204379383U	2015-06-10
CN204318866U	2015-05-13
US20170066568A1	2017-03-09
US20060200046A1	2006-09-07

CHENGDU ZHIJISHI PATENT AGENCY (CN)

View/Download PDF      PDF Help

Previous Patent: CANNULA ASSEMBLY WITH MOVABLE AND EXPANDABLE BALLOON

Next Patent: COMBINED PACKAGING SYSTEM FOR MEDICAL INSTRUMENT