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Patent Searching and Data


Title:
COMBINED PROCESSING METHOD AND COMBINED PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/145929
Kind Code:
A1
Abstract:
The present invention enables thermal cutting and machining to be performed by means of a simple and inexpensive combined processing device. This method is a method for cutting a cut member out of an original sheet by means of thermal cutting and machining, and includes a hole-cutting process, a finishing process, and an outer periphery-cutting process. During the hole-cutting process, a hole is created in the original sheet by means of thermal cutting while leaving a machining allowance in addition to the finished size of the hole. During the finishing process, a cutting tool is inserted into the hole which has been created through the hole-cutting process, and the cutting tool is guided along the inner circumference of the hole so as to cut the thermally cut end face in order to machine the hole to the finished size. During the outer periphery-cutting process, the outer periphery of the cut member is cut by means of thermal cutting in order to take the cut member out of the original sheet.

Inventors:
YAMAGUCHI YOSHIHIRO (JP)
KITAMURA KAZUYUKI (JP)
KONDO KEITA (JP)
Application Number:
PCT/JP2013/053818
Publication Date:
October 03, 2013
Filing Date:
February 18, 2013
Export Citation:
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Assignee:
KOMATSU IND CORP (JP)
International Classes:
B23P23/04; B23K7/00; B23K10/00; B23K26/00; B23K26/38
Foreign References:
JPS63120045A1988-05-24
JPH05116010A1993-05-14
JPS63180390A1988-07-25
JPH05261610A1993-10-12
JP2000326159A2000-11-28
JP2007125567A2007-05-24
JPS63134143A1988-06-06
Attorney, Agent or Firm:
Shinjyu Global IP (JP)
fresh green -- a global IP patent business corporation (JP)
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