COMBINED SENSOR AND ELECTRONIC DEVICE

WIPO Patent Application WO/2020/113698

A1

Disclosed are a combined sensor (100) and an electronic device. The combined sensor (100) comprises a cover (10), a substrate (30), an environment sensor (50) and an acoustics sensor (70), wherein the substrate (30) and the cover (10) enclose an accommodation cavity (10a); the environment sensor (50) comprises an MEMS environment chip (51) arranged in the accommodation cavity (10a) and a first ASIC chip (53) embedded in the substrate (30), with the first ASIC chip (53) being electrically connected to the MEMS environment chip (51) by means of a first pin (55); and the acoustics sensor (70) comprises an MEMS microphone chip (71) arranged in the accommodation cavity (10a) and a second ASIC chip (73) embedded in the substrate (30), with the MEMS microphone chip (71) being electrically connected to the second ASIC chip (73) by means of a second pin (75). The MEMS environment chip (51) and the MEMS microphone chip (71) are arranged at an interval, and the first pin (55) and the second pin (75) are respectively distributed at two different side edges of the substrate (30). According to the combined sensor (100) and the electronic device, the interference of the environment sensor (50) to the acoustics sensor (70) can be reduced.

PAN XINCHAO (CN)
WANG DEXIN (CN)
DUANMU LUYU (CN)
YANG JUNWEI (CN)
QIU WENRUI (CN)

PCT/CN2018/122920

June 11, 2020

December 22, 2018

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GOERTEK INC (CN)

H04R19/04

CN205616567U	2016-10-05
CN206457247U	2017-09-01
CN103762213A	2014-04-30
CN202949568U	2013-05-22
CN108282731A	2018-07-13
CN107005771A	2017-08-01
US9813790B1	2017-11-07

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