Title:
COMMUNICATION MODULE PACKAGE
Document Type and Number:
WIPO Patent Application WO/2022/114580
Kind Code:
A1
Abstract:
The present invention relates to a communication module package comprising: a first substrate; a first antenna disposed on a first surface of the first substrate; a communication control chip positioned on a second surface positioned opposite to the first surface of the first substrate; a molding part positioned on the second surface of the first substrate and capsulating the communication control chip; a second substrate including a coupling part facing the first surface of the first substrate and an extending part extending over at least a part of the edge of the first surface of the first substrate; and at least one second antenna disposed on the second substrate, and receiving a wireless communication signal through cooperation with the first antenna to transmit the wireless communication signal to the communication control chip.
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Inventors:
JEON CHAN IK (KR)
MOON BYUNG IN (KR)
MOON BYUNG IN (KR)
Application Number:
PCT/KR2021/015865
Publication Date:
June 02, 2022
Filing Date:
November 04, 2021
Export Citation:
Assignee:
PARTRON CO LTD (KR)
International Classes:
H04B1/50; H01Q1/38; H04B1/00; H04B1/401; H04B5/00
Foreign References:
| KR20190123122A | 2019-10-31 | |||
| KR20190013382A | 2019-02-11 | |||
| KR20190142862A | 2019-12-30 | |||
| KR20200120543A | 2020-10-21 | |||
| US20090231206A1 | 2009-09-17 |
Attorney, Agent or Firm:
E-BIRD INTERNATIONAL IP LAW FIRM (KR)
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