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Title:
COMPACT INCLUDING, AS CONSTITUENT, MOLDED ARTICLE FORMED OF SEMIAROMATIC POLYAMIDE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/059357
Kind Code:
A1
Abstract:
This compact has a structure in which a molded article (D) and a heat-curable resin (E) that contains a glycidyl group are directly interfaced. The molded article (D) comprises a semiaromatic polyamide resin composition (C) that has an equilibrium water absorption ratio of 3.0% or less at 80°C and 95% RH, and that contains 0–200 parts by mass of a reinforcing material (B) relative to 100 parts by mass of a semiaromatic polyamide resin (A) for which the peak area associated with cooling crystallization measured by differential scanning calorimetry (DSC), the glass transition temperature, and the sum of the terminal amino group concentration and the terminal carboxyl group concentration satisfy designated conditions. The compact has high water absorption dimensional stability, heat resistance, and adhesiveness.

Inventors:
TAMATSUSHIMA Makoto (1-1, Katata 2-chome, Otsu-sh, Shiga 92, 〒5200292, JP)
NAKAO Junichi (1-1, Katata 2-chome, Otsu-sh, Shiga 92, 〒5200292, JP)
Application Number:
JP2018/035096
Publication Date:
March 28, 2019
Filing Date:
September 21, 2018
Export Citation:
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Assignee:
TOYOBO CO., LTD. (2-8 Dojima Hama 2-chome, Kita-ku Osaka-sh, Osaka 30, 〒5308230, JP)
International Classes:
C08J5/12; B32B27/34; C08G69/02; C08L77/06
Domestic Patent References:
WO2015019882A12015-02-12
Foreign References:
JP2017119433A2017-07-06
JP2012086578A2012-05-10
JP2012167285A2012-09-06
JP2007204683A2007-08-16
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