Title:
COMPACT OPTICALLY EFFICIENT SOLID STATE LIGHT SOURCE WITH INTEGRATED THERMAL MANAGEMENT
Document Type and Number:
WIPO Patent Application WO/2012/005771
Kind Code:
A3
Abstract:
A compact and efficient LED array lighting component comprising a circuit board with an array of LED chips mounted on it and electrically interconnected. A plurality of primary lenses is included, each of which is formed directly over each LED chip and/or a sub-group of the LED chips. A heat sink is included with the circuit board mounted to the heat sink so that heat from the LED chips spreads into the heat sink. In some embodiments the circuit board can be thermally conductive and electrically insulating. Method of forming an LED component are also disclosed utilizing chip-on-board mounting techniques for mounting the LED chips on the circuit board, and molding of the primary lenses directly over the LED chips individually or in sub-groups of LED chips.
Inventors:
BHAT CHANDAN (US)
LOWES THEODORE DOUGLAS (US)
GARCERAN JULIO (US)
KELLER BERND (US)
LOWES THEODORE DOUGLAS (US)
GARCERAN JULIO (US)
KELLER BERND (US)
Application Number:
PCT/US2011/001200
Publication Date:
June 28, 2012
Filing Date:
July 06, 2011
Export Citation:
Assignee:
CREE INC (US)
BHAT CHANDAN (US)
LOWES THEODORE DOUGLAS (US)
GARCERAN JULIO (US)
KELLER BERND (US)
BHAT CHANDAN (US)
LOWES THEODORE DOUGLAS (US)
GARCERAN JULIO (US)
KELLER BERND (US)
International Classes:
H01L25/075; F21V5/00; H01L33/00
Foreign References:
| US20080170396A1 | 2008-07-17 | |||
| US20070115670A1 | 2007-05-24 | |||
| US20030053310A1 | 2003-03-20 | |||
| US20040239242A1 | 2004-12-02 | |||
| US20030072153A1 | 2003-04-17 |
Attorney, Agent or Firm:
HEYBL, Jaye, G. et al. (Patrick Heybl & Philpott,2815 Townsgate Road, Suite 21, Westlake Village CA, US)
Download PDF: