COMPACT TILTED VIBRATION SENSOR AND METHOD OF MANUFACTURING THE SAME

Title:

COMPACT TILTED VIBRATION SENSOR AND METHOD OF MANUFACTURING THE SAME

Document Type and Number:

WIPO Patent Application WO/2007/021039

Kind Code:

A1

Abstract:

Provided are a tilted vibration sensor incorporating a plurality of electrodes and a conductive spherical body which is turned on and off by the moving displacement of the spherical body, and which may be remarkably reduced in size and may have high performance and high operating sensitivity, high durability, and high reliability; and a method of manufacturing the sensor. The case (1) of the sensor comprises a case body (5) formed of a non-conductive material having such excellent gas-barrier property and heat resistance that can stop the transmission of gases which affects on the on/off operation of the sensor due to the moving displacement of the conductive spherical body (4) and a cover body (7) sealing airtight the opening part (6) of the case body. In the method of manufacturing the vibration sensor, moisture and particulate impurities affecting the on/off operation are removed from the hollow part (2) of the case (1), and the hollow part is evacuated.

More Like This:

JPS59109048	[Title of the device] Fall switch
WO/1992/017895	ELECTRICAL TIPPING CONTACT

Inventors:

SHIMASE TERUO (JP)

Application Number:

PCT/JP2006/317021

Publication Date:

February 22, 2007

Filing Date:

August 17, 2006

Export Citation:

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Assignee:

DEVICE CORP G (JP)
SHIMASE TERUO (JP)

International Classes:

H01H35/02; G01C9/10

Foreign References:

JP2004177388A	2004-06-24
JPH07176255A	1995-07-14
JP2004171797A	2004-06-17
JP2004311951A	2004-11-04
JP2001358241A	2001-12-26
JPH06162896A	1994-06-10
JP2005016965A	2005-01-20

Other References: