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Title:
COMPLIANT WAFER PROBE ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2023/098119
Kind Code:
A1
Abstract:
Aspects of the invention include a wafer test device with a conformal laminate and rigid probes extending from the laminate to form an electrical connection with a microcircuit under test. The wafer test device also includes a spring plate on a side of the laminate that is opposite a side from which the rigid probes extend. The spring plate includes a conformal inner frame and a rigid outer frame. The laminate is attached to the inner frame of the spring plate.

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Inventors:
AUDETTE DAVID MICHAEL (US)
WAGNER GRANT (US)
MOORE JACOB LOUIS (US)
NEFF PETER WILLIAM (US)
Application Number:
PCT/CN2022/108547
Publication Date:
June 08, 2023
Filing Date:
July 28, 2022
Export Citation:
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Assignee:
IBM (US)
IBM CHINA CO LTD (CN)
International Classes:
H01L21/66; G01R1/067; H01R13/62
Foreign References:
US20060249857A12006-11-09
CN111384010A2020-07-07
US20210080486A12021-03-18
US20210082860A12021-03-18
US20140167801A12014-06-19
US20110074080A12011-03-31
CN110120357A2019-08-13
CN103229066A2013-07-31
Attorney, Agent or Firm:
CCPIT PATENT AND TRADEMARK LAW OFFICE (CN)
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