Title:
COMPONENT FOR ACCOMMODATING ELECTRONIC COMPONENT, ELECTRONIC MODULE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/015040
Kind Code:
A1
Abstract:
The disclosed component for accommodating an electronic component includes: a substrate having an installation region for installing an electronic component; a connection conductor provided from the upper surface of the substrate to the lower surface thereof and electrically connected to the electronic component; a wiring conductor provided on the lower surface of the substrate, one end of the wiring conductor being electrically connected to the connection conductor and the other end being drawn out sideward of the substrate; and a grounding conductor provided on the lower surface of the substrate and forming a coplanar line together with the wiring conductor. The lower surface of the wiring conductor is located above the lower surface of the grounding conductor.
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Inventors:
TSUJINO, Mahiro (Shiga Gamo Plant 10-1, Kawai-cho, Higashioumi-sh, Shiga 95, 〒5291595, JP)
Application Number:
JP2011/067495
Publication Date:
February 02, 2012
Filing Date:
July 29, 2011
Export Citation:
Assignee:
KYOCERA CORPORATION (6 Takeda Tobadono-cho, Fushimi-ku kyoto-sh, Kyoto 01, 〒6128501, JP)
京セラ株式会社 (〒01 京都府京都市伏見区竹田鳥羽殿町６番地 Kyoto, 〒6128501, JP)
京セラ株式会社 (〒01 京都府京都市伏見区竹田鳥羽殿町６番地 Kyoto, 〒6128501, JP)
International Classes:
H01L23/04; H01L23/02; H01L23/12
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Claims: