Title:
COMPONENT ALIGNMENT DEVICE AND METHOD FOR PRODUCING ELECTRONIC COMPONENTS
Document Type and Number:
WIPO Patent Application WO/2010/137546
Kind Code:
A1
Abstract:
Provided is a component alignment device which makes it possible to reliably align a plurality of electronic components at the correct orientation even when such components are miniaturized and especially very thin components. Electronic components (1) which are to be aligned have a cuboid shape in which the length dimension is (L), the width dimension is (W) and the thickness dimension is (T). The component alignment device has a component alignment jig (12) which comprises electronic component receiving recesses (15) that are open at the surface. The depth (Z) of the receiving recesses (15) is shorter than the length (L) of the electronic components (1), such that one electronic component (1) is held in an electronic component receiving recess (15) in a state in which one of the WT faces is at the top, and partially projects upwards from said recess. When the receiving recesses (15) are seen as a plane, W > s > T, where (s) denotes the shortest gap which is greater than the thickness (T) and is the narrowest distance inside the opposing distance on the inner peripheral surface of the receiving recesses (15).
Inventors:
MIYAZAKI, Toshiki (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
Application Number:
JP2010/058716
Publication Date:
December 02, 2010
Filing Date:
May 24, 2010
Export Citation:
Assignee:
MURATA MANUFACTURING CO., LTD. (10-1, Higashikotari 1-chome Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
株式会社村田製作所 (〒55 京都府長岡京市東神足１丁目１０番１号 Kyoto, 〒6178555, JP)
株式会社村田製作所 (〒55 京都府長岡京市東神足１丁目１０番１号 Kyoto, 〒6178555, JP)
International Classes:
H01G13/00
Attorney, Agent or Firm:
MIYAZAKI, Chikara et al. (6F Daido Seimei Bldg, 5-4 Tanimachi 1-chome, Chuo-ku, Osaka-sh, Osaka 12, 〒5400012, JP)
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