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Patent Searching and Data


Title:
COMPONENT ASSEMBLING DEVICE AND ASSEMBLING METHOD
Document Type and Number:
WIPO Patent Application WO/2006/061933
Kind Code:
A1
Abstract:
A component assembling device positioning one end of a circuit board (203) on a backup tool (12) and connecting one end of an electronic component on the upper surface of the one end of the circuit board. The component assembling device has a conveyance cable (21) that conveys the circuit board to the backup tool and has a reception member (30) and a pressing member (35) that receive the circuit board conveyed by the conveyance table and position and hold the one end on the backup tool.

Inventors:
IKEDA KAZUHITO (JP)
TOGASHI NORIKAZU (JP)
Application Number:
PCT/JP2005/016790
Publication Date:
June 15, 2006
Filing Date:
September 13, 2005
Export Citation:
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Assignee:
SHIBAURA MECHATRONICS CORP (JP)
IKEDA KAZUHITO (JP)
TOGASHI NORIKAZU (JP)
International Classes:
B23P19/02; B23P21/00; H05K13/04
Foreign References:
JP2003159702A2003-06-03
Attorney, Agent or Firm:
Suzuye, Takehiko c/o SUZUYE & SUZUYE (1-12-9 Toranomo, Minato-ku Tokyo 01, JP)
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