Title:
COMPONENT EMBEDDED SUBSTRATE AND METHOD FOR MANUFACTURING COMPONENT EMBEDDED SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2017/103998
Kind Code:
A1
Abstract:
A component embedded substrate (30) has: a first insulator (13) containing an insulating resin material; an IC component (4), which has a first terminal that is provided on the first surface side, and a second terminal that is provided on the second surface side having a structure more fragile than the first surface side, and which is embedded in the first insulator; a first terminal wiring pattern (9) that electrically connects the first terminal of the IC component and outside of the first insulator to each other; a second terminal wiring pattern (18), which is provided with a metal layer (15) formed on the surface of the first insulator, said metal layer being provided with through holes (19), and conducting vias (17) penetrating the first insulator, said conducting vias electrically connecting the second terminal and the metal layer to each other, and which electrically connects the second terminal of the IC component and the outside of the first insulator to each other; and an insulating resin material-containing second insulator (23) applied to the through holes around the conducting vias.
Inventors:
TODA MITSUAKI (JP)
MATSUMOTO TOHRU (JP)
AOKI KENTARO (JP)
MATSUMOTO TOHRU (JP)
AOKI KENTARO (JP)
Application Number:
PCT/JP2015/085086
Publication Date:
June 22, 2017
Filing Date:
December 15, 2015
Export Citation:
Assignee:
MEIKO ELECTRONICS CO LTD (JP)
International Classes:
H01L23/12; H05K3/46
Domestic Patent References:
| WO2014184873A1 | 2014-11-20 |
Foreign References:
| JP2008091471A | 2008-04-17 | |||
| JP2003204128A | 2003-07-18 |
Attorney, Agent or Firm:
NAGATO, Kanji (JP)
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