Title:
COMPONENT-EMBEDDED SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND HIGH-FREQUENCY MODULE
Document Type and Number:
WIPO Patent Application WO/2018/003391
Kind Code:
A1
Abstract:
This method for manufacturing a component-embedded substrate comprises: a resist formation step; a patterning step; a first electrode formation step; a resist removal step; a component arrangement step; a substrate formation step; and a separation step. In the resist formation step, a resist (53) for patterning is formed on a support (51). In the patterning step, patterning is applied to the resist (53) to form a through-hole that runs through the resist. In the first electrode formation step, a through-via electrode is formed by filling the through-hole with an electrode material. The resist (53) is removed in the resist removal step, and an electronic component is arranged in the component arrangement step. In the substrate formation step, a resin substrate is formed by sealing the electronic component with resin. In the separation step, the support (51) is separated from the resin substrate. In this manufacturing method, the first electrode formation step is performed before the substrate formation step.
Inventors:
SOMADA HIROSHI (JP)
Application Number:
PCT/JP2017/020382
Publication Date:
January 04, 2018
Filing Date:
June 01, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/18; H05K3/40; H05K3/46
Domestic Patent References:
| WO2014188760A1 | 2014-11-27 | |||
| WO2009072482A1 | 2009-06-11 | |||
| WO2008136251A1 | 2008-11-13 | |||
| WO2010150522A1 | 2010-12-29 | |||
| WO2015119396A1 | 2015-08-13 |
Foreign References:
| JP2008277750A | 2008-11-13 | |||
| JP2006114621A | 2006-04-27 | |||
| US20080189942A1 | 2008-08-14 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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