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Patent Searching and Data


Title:
COMPONENT FOR EVAPORATIVE PATTERN AND EVAPORATIVE PATTERN
Document Type and Number:
WIPO Patent Application WO/2012/101828
Kind Code:
A1
Abstract:
The present invention yields a lightweight mold provided with requisite rigidity. A plurality of rod-shaped members formed from an evaporative material and a plurality of connecting members formed from an evaporative material are prepared. Each of the connecting members is spherical, and end sections of the plurality of rod-shaped members can be secured to a single connecting member. The angle at which the rod-shaped members are secured to the connecting member can be adjusted as needed; therefore, three-dimensional mesh structures having a variety of shapes can be formed. An evaporative pattern provided with a three-dimensional mesh structure can be manufactured by combining the plurality of rod-shaped members and the plurality of connecting members. Performing full mold casting using the evaporative pattern makes it possible to manufacture a mold provided with a three-dimensional mesh structure. Adjusting the shape of the three-dimensional mesh structure makes it possible to obtain the requisite rigidity for the mold and reduce the weight of the mold.

Inventors:
SATO MASANORI (JP)
TAKAHASHI MASASHI (JP)
KATAGIRI MIKINE (JP)
KATO AKIJI (JP)
MIZUTANI SOHEI (JP)
SHITIDA KENICHI (JP)
NANBA TSUYOSHI (JP)
OKABE SUSUMU (JP)
NOJIRI ISAO (JP)
Application Number:
PCT/JP2011/051824
Publication Date:
August 02, 2012
Filing Date:
January 28, 2011
Export Citation:
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Assignee:
TOYOTA MOTOR CO LTD (JP)
SATO MASANORI (JP)
TAKAHASHI MASASHI (JP)
KATAGIRI MIKINE (JP)
KATO AKIJI (JP)
MIZUTANI SOHEI (JP)
SHITIDA KENICHI (JP)
NANBA TSUYOSHI (JP)
OKABE SUSUMU (JP)
NOJIRI ISAO (JP)
International Classes:
B22C9/04; B21D37/02; B21D37/20; B22C7/02
Domestic Patent References:
WO2000015370A12000-03-23
Foreign References:
JPH02192844A1990-07-30
JPS61266147A1986-11-25
Attorney, Agent or Firm:
KAI-U PATENT LAW FIRM (JP)
Patent business corporation KAI-U Patent Law Firm (JP)
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Claims: