Title:
COMPONENT FOR FILM-FORMING APPARATUS AND METHOD FOR REMOVING FILM ADHERED TO THE COMPONENT FOR FILM-FORMING APPARATUS
Document Type and Number:
WIPO Patent Application WO2010109685
Kind Code:
A1
Abstract:
Disclosed is a component for a film-forming apparatus, from which an adhering film formed thereon can be easily removed. Also disclosed is a method for removing an adhering film, which can efficiently remove an adhering film formed on a component for a film-forming apparatus. The component for a film-forming apparatus comprises a base, a precoat layer formed on the base and a porous thermal sprayed layer formed on the precoat layer, and is characterized in that the precoat layer is composed of an aqueous inorganic coating agent and the difference between the linear thermal expansion coefficient (a1) of the base and the linear thermal expansion coefficient (a2) of the precoat layer (|a1 - a2|) is not more than 18 × 10-6/°C. The method for removing an adhering film is characterized in that, after an adhering film is formed, the precoat layer is treated with water and/or water vapor and then the adhering film is removed.
Inventors:
UOTA SEIKI (JP)
YASUMARU JUNICHI (JP)
UEGUCHI AKITO (JP)
YASUMARU JUNICHI (JP)
UEGUCHI AKITO (JP)
Application Number:
PCT/JP2009/062830
Publication Date:
September 30, 2010
Filing Date:
July 15, 2009
Export Citation:
Assignee:
KANSAI COKE & CHEMICALS CO LTD (JP)
KN LAB ANALYSIS CO LTD (JP)
UOTA SEIKI (JP)
YASUMARU JUNICHI (JP)
UEGUCHI AKITO (JP)
KN LAB ANALYSIS CO LTD (JP)
UOTA SEIKI (JP)
YASUMARU JUNICHI (JP)
UEGUCHI AKITO (JP)
International Classes:
C23C14/00; C23C28/00
Foreign References:
| JPS61243176A | 1986-10-29 | |||
| JP2003192472A | 2003-07-09 | |||
| JP2002115063A | 2002-04-19 | |||
| JP2000246198A | 2000-09-12 | |||
| JP2001247957A | 2001-09-14 |
Attorney, Agent or Firm:
UEKI, Kyuichi et al. (JP)
Hisakazu Ueki (JP)
Hisakazu Ueki (JP)
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