Title:
COMPONENT INSTALLATION DEVICE AND COMPONENT INSTALLATION METHOD, MOUNTING SUBSTRATE MANUFACTURING SYSTEM AND MOUNTING SUBSTRATE MANUFACTURING METHOD, AND INSTALLED COMPONENT INSPECTION DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/189108
Kind Code:
A1
Abstract:
This mounting substrate manufacturing system has a solder section formed on a substrate, and includes a component-installing device that installs a component in this solder section. According to this system, mounting point position data obtained by making actual measurements of the substrate is associated with identification information of the substrate. Also, the position of the solder section formed on the substrate is measured, and solder section position data is created. Then, the solder section position data is associated with the substrate identification information. Furthermore, installation-target position data is created on the basis of the mounting point position data and the solder section position data identified by the same identification information, the installation-target position data including the installation-target position of the component identified by the identification information.
Inventors:
TANIGUCHI MASAHIRO
NAGAYA TOSHIHIKO
KITA TAKAYUKI
TANAKA TETSUYA
KIHARA MASAHIRO
NAGAYA TOSHIHIKO
KITA TAKAYUKI
TANAKA TETSUYA
KIHARA MASAHIRO
Application Number:
PCT/JP2020/005512
Publication Date:
September 24, 2020
Filing Date:
February 13, 2020
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H05K13/08; H05K13/04
Domestic Patent References:
| WO2018189937A1 | 2018-10-18 |
Foreign References:
| JP2003229699A | 2003-08-15 | |||
| JPH05251897A | 1993-09-28 | |||
| JP2015099863A | 2015-05-28 |
Attorney, Agent or Firm:
KAMATA Kenji et al. (JP)
Download PDF:
Previous Patent: AUDIO SIGNAL PROCESSING METHOD, DEVICE AND PROGRAM
Next Patent: FLY ASH MODIFICATION METHOD
Next Patent: FLY ASH MODIFICATION METHOD