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Patent Searching and Data


Title:
COMPONENT MANUFACTURING METHOD AND COMPONENT
Document Type and Number:
WIPO Patent Application WO/2013/024837
Kind Code:
A1
Abstract:
This component manufacturing method sequentially comprises at least: a step (A1) of forming, by sputtering, an alloy film having tin as a principal component on one surface of a substrate, using a substrate in which one surface comprises nickel; a step (A3) of placing a component, in which at least a portion that comes into contact with the alloy film comprises copper or comprises nickel-coated aluminum, on the alloy film; and a step (A4) of applying heat treatment in order to bond the substrate and the alloy film to each other and the alloy film and the component to each other. In step (A1), a cathode electrode and an anode electrode are arranged opposite each other in a space having a reduced-pressure atmosphere, the cathode electrode being provided with an alloy target having tin as a principal component, and the anode electrode being provided with the substrate; and a DC voltage is applied to the cathode electrode when the alloy film is being formed on the aforementioned one surface of the substrate.

Inventors:
NAKAMUTA YUU (JP)
MATSUMOTO MASAHIRO (JP)
INAGAKI TAKAYUKI (JP)
HIRAMATSU DAISUKE (JP)
TANI NORIAKI (JP)
Application Number:
PCT/JP2012/070609
Publication Date:
February 21, 2013
Filing Date:
August 13, 2012
Export Citation:
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Assignee:
ULVAC INC (JP)
NAKAMUTA YUU (JP)
MATSUMOTO MASAHIRO (JP)
INAGAKI TAKAYUKI (JP)
HIRAMATSU DAISUKE (JP)
TANI NORIAKI (JP)
International Classes:
H01L21/60; C23C14/06; C23C14/34
Foreign References:
JP2002043352A2002-02-08
JPH0677467A1994-03-18
JP2010098799A2010-04-30
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
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Claims: