COMPONENT MANUFACTURING TOOL AND COMPONENT MANUFACTURING METHOD

Title:

COMPONENT MANUFACTURING TOOL AND COMPONENT MANUFACTURING METHOD

Document Type and Number:

WIPO Patent Application WO/2018/207793

Kind Code:

A1

Abstract:

The purpose of the present invention is to provide a component manufacturing tool and a component manufacturing method with which suction-attachment onto a chuck table can be achieved even under a heated environment. A component manufacturing tool 1 comprises a frame body 10 and a holding film 20 covering an opening portion 10h. The frame body 20 is provided with a first frame 11 and a second frame 12. The holding film 20 is provided with a base layer 21 and a holding layer 22 provided on one surface side, and is held in an extended state between the first frame 11 and the second frame 12. The base layer 21 is such that a ratio RE1(= E'(100)/E'(25)) of an elastic modulus E'(100°C) and an elastic modulus E'(25°C) is 0.2 ≤ RE1 ≤ 1, where E'(25) is not less than 35 MPa and not more than 3500 MPa. The component manufacturing method is provided with: a component holding step of holding a component onto the holding layer 22 of the component manufacturing tool 1; and a suction-attachment step in which a holding film being held is fixed by suction-attachment onto a surface of a heated chuck table.

Inventors:

HAYASHISHITA EIJI (JP)

Application Number:

PCT/JP2018/017833

Publication Date:

November 15, 2018

Filing Date:

May 08, 2018

Export Citation:

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Assignee:

MITSUI CHEMICALS TOHCELLO INC (JP)

International Classes:

C09J7/20; H01L21/683; C09J201/00; H01L21/301

Domestic Patent References:

WO2017002610A1	2017-01-05
WO2014192630A1	2014-12-04

Foreign References:

JP2012114265A	2012-06-14
JP2012188597A	2012-10-04
JPH08330372A	1996-12-13
JP2013084794A	2013-05-09

Other References: