Title:
COMPONENT MOUNTER
Document Type and Number:
WIPO Patent Application WO/2018/134892
Kind Code:
A1
Abstract:
Provided is a component mounter that mounts an electronic component on a substrate. The component mounter is provided with: a conveying device for conveying a substrate to a mounting position, where a mounting process of mounting an electronic component on the substrate is executed; a background member provided with a background part that creates a gradation between the background part and the surface of the substrate; a background member moving apparatus capable of moving the background member between a predetermined placement position and a standby position, which differs from the placement position; and an imaging device capable of simultaneously imaging both an edge of the substrate and the background part when the background member moving apparatus has placed the background member at the placement position and when the conveying device has stopped the substrate at the mounting position.
Inventors:
KOBAYASHI TAKAHIRO (JP)
OIKE HIROSHI (JP)
OIKE HIROSHI (JP)
Application Number:
PCT/JP2017/001413
Publication Date:
July 26, 2018
Filing Date:
January 17, 2017
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/04; H05K13/08
Domestic Patent References:
| WO2015040755A1 | 2015-03-26 | |||
| WO2016135635A1 | 2016-09-01 |
Foreign References:
| JP2012212817A | 2012-11-01 | |||
| JP2014078580A | 2014-05-01 |
Attorney, Agent or Firm:
KAI-U PATENT LAW FIRM (JP)
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