COMPONENT MOUNTING APPARATUS AND METHOD FOR CONTROLLING LIFT OF COMPONENT HOLDING DEVICE

WIPO Patent Application WO/2014/049688

A1

This component mounting apparatus is configured by including: (a) a multi-measuring-point measuring unit, which measures the heights of a plurality of measuring points (90) by controlling a head moving apparatus and a height sensor, said measuring points being provided on a base (20); (b) a head shift estimating unit that estimates, on the basis of the heights of the measuring points (90), a shift (∆h) of a component mounting head (30) moved by means of a head moving apparatus (32), said shift being in the height direction with respect to a reference height (H0), and having been generated due to heat generated with operations of the component mounting apparatus; and (c) a holding device moving quantity correcting unit that corrects, on the basis of the thus estimated shift (∆h) of the component mounting head (30), the quantity of vertical direction movement of a component holding device (70) at the time of controlling, in the vertical direction, the position of the component holding device (70) by means of a holding device lifting apparatus. With such configuration, the height of the component holding device (70) can be controlled such that the component holding device is at a suitable position.

MAEDA FUMITAKA (JP)
ITO HIDETOSHI (JP)

PCT/JP2012/074572

April 03, 2014

September 25, 2012

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FUJI MACHINE MFG (JP)

H05K13/04

JPH0818289A	1996-01-19
JP2008294030A	2008-12-04
JP2011044515A	2011-03-03
JPH11186795A	1999-07-09
JP2008294031A	2008-12-04
JP2006041260A	2006-02-09

CHUBU PATENT OFFICE (JP)
Central patent business corporation international patent firm (JP)

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