Title:
COMPONENT MOUNTING APPARATUS AND METHOD
Document Type and Number:
WIPO Patent Application WO/2010/125912
Kind Code:
A1
Abstract:
A component mounting apparatus comprises a conveyance unit (20) which positions an object to be mounted at the work position while holding and conveying the object, a component feed unit (50) which defines the component feed position corresponding to the mounting position of the object to be mounted located at the work position from below and then fees and positions a component, a mounting unit (30) having mounting tools (31-33) which are supported to freely ascend and descend between a stand-by position corresponding to the mounting position of the object to be mounted located at the work position from above, and the component feed position in order to receive a component and mount the component on the object to be mounted, and an ascending and descending drive unit (40) which drives the mounting unit to ascend and descend so that the mounting tools receive the component located at the component feed position and mount the component on the object to be mounted located at the work position. Thus, simplification and intensification of the structure, space saving of the installation area of the apparatus, and the like, can be achieved.
Inventors:
WATANABE Toshiyuki (9-20 Togoshi 3-chome, Shinagawa-k, Tokyo 41, 〒1420041, JP)
Application Number:
JP2010/056640
Publication Date:
November 04, 2010
Filing Date:
April 14, 2010
Export Citation:
Assignee:
HIRATA CORPORATION (9-20, Togoshi 3-chome Shinagawa-k, Tokyo 41, 〒1420041, JP)
平田機工株式会社 (〒41 東京都品川区戸越３丁目９番２０号 Tokyo, 〒1420041, JP)
平田機工株式会社 (〒41 東京都品川区戸越３丁目９番２０号 Tokyo, 〒1420041, JP)
International Classes:
B23P21/00; B23P19/00; B23P19/06
Attorney, Agent or Firm:
YAMAMOTO Takatoshi (Nishishinbashi-Fukutoku Bldg, 11-5 Nishishinbashi 1-chome, Minato-k, Tokyo 03, 〒1050003, JP)