COMPONENT MOUNTING APPARATUS

WIPO Patent Application WO/2014/068766

A1

In this component mounting apparatus, an apparatus base is provided with: a substrate transfer apparatus that carries in, aligns, and carries out a substrate; a component supply apparatus that supplies a plurality of kinds of components; and a component placing apparatus having a component mounting head, which picks up a component from the component supply apparatus, and which mounts the component on the aligned substrate, and a head drive mechanism that moves the component mounting head within a horizontal plane. The component mounting apparatus is also provided with: a camera apparatus that is capable of picking up an image or a plurality of images of the substrate from above the substrate without interlocking with the movement of the component mounting head; and an image pickup control apparatus, which makes the camera apparatus pick up an image of a subject portion at timing excluding timing at which the component mounting head moves and blocks the image pickup visual field of the camera apparatus, said subject portion being provided on the substrate. Consequently, production efficiency of the substrate can be improved compared with conventional cases, operation qualities are improved by applying the camera apparatus to various purposes, and cost performance is also improved.

MAEDA FUMITAKA (JP)
ITO HIDETOSHI (JP)

PCT/JP2012/078484

May 08, 2014

November 02, 2012

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FUJI MACHINE MFG (JP)

H05K13/04; H05K13/08

WO2012026101A1

2012-03-01

JP2002026595A	2002-01-25
JP2002009494A	2002-01-11
JP2001244696A	2001-09-07
JPH06216576A	1994-08-05
JP2009164357A	2009-07-23
JP2003060397A	2003-02-28
JP2003282640A	2003-10-03

KOBAYASHI OSAMU (JP)
Kobayashi 脩 (JP)

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