Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
COMPONENT MOUNTING AND BONDING APPARATUS, AND COMPONENT MOUNTING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2018/105838
Kind Code:
A1
Abstract:
To solve the above problem, a component mounting and bonding apparatus according to an embodiment of the present invention comprises: a camera for photographing a substrate so as to obtain an image of the substrate; a unit determination part for determining, through the image, whether a unit existing on the substrate is a bad unit or a normal unit; a substrate region division part for dividing the substrate into as many substrate regions as the number of multiple gantries, on the basis of information obtained through the unit determination by the unit determination part; and a drive part for driving the multiple gantries to mount components on the divided substrate regions respectively.

Inventors:
SHIN DAE GUN (KR)
Application Number:
PCT/KR2017/006327
Publication Date:
June 14, 2018
Filing Date:
June 16, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HANWHA TECHWIN CO LTD (KR)
International Classes:
H05K13/04; H05K13/08
Foreign References:
JP2015162519A2015-09-07
KR20130076383A2013-07-08
US20120015458A12012-01-19
JP5187201B22013-04-24
KR20160062042A2016-06-01
Attorney, Agent or Firm:
KASAN IP & LAW FIRM (KR)
Download PDF: