Title:
COMPONENT MOUNTING DEVICE AND METHOD FOR PRODUCING MOUNTING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/012935
Kind Code:
A1
Abstract:
This mounting module comprises: a power unit for generating a driving force by air pressure; a first air pathway for supplying power air to the power unit; a second air pathway for discharging air from the power unit; and a third air pathway branching off from at least one of the first air pathway and the second air pathway. A base comprises: a tape collection unit for collecting waste tape resulting after a component has been removed from a tape by the mounting module; and a fourth air pathway for supplying air to the tape collection unit. When installed on the base, the mounting module enters a state of being able to mount the component on a substrate, and a connecting part of the third air pathway is connected together therewith to the fourth air pathway, entering a state of being able to supply air from the third air pathway to the fourth air pathway.
Inventors:
OSHIMA HIROYUKI (JP)
Application Number:
PCT/JP2021/028960
Publication Date:
February 09, 2023
Filing Date:
August 04, 2021
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/02
Foreign References:
| JP2015012180A | 2015-01-19 | |||
| JP2011228376A | 2011-11-10 | |||
| JP2016207736A | 2016-12-08 | |||
| JP2009061544A | 2009-03-26 | |||
| JP2017069438A | 2017-04-06 |
Attorney, Agent or Firm:
KAI-U PATENT LAW FIRM (JP)
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