COMPONENT MOUNTING DEVICE

WIPO Patent Application WO/2015/079545

A1

Existing component mounting devices have the problem that correction amounts obtained before component mounting operations are used for mounting-position correction, making it impossible to accommodate mounting-position changes due to vibration of the device during mounting operations. This invention is characterized by the provision of a component attachment unit, a first imaging unit that captures a first image of said component attachment unit before reaching a position above a substrate, a second imaging unit that captures a second image of at least part of the substrate when above said substrate, and a processing unit. This invention is also characterized in that: the component attachment unit contains illuminating optics that form an illuminated region on the substrate; and the processing unit uses the first image to obtain a first positional relationship indicating the positional relationship between the illuminated region and a component held by the component attachment unit, uses the second image to obtain a second positional relationship indicating the positional relationship between the illuminated region and the position where said component is to be mounted, and determines the position of the component such that the first positional relationship and the second positional relationship are essentially congruent.

TAKANO ERII (JP)
SAEGUSA TAKASHI (JP)
ITO KIYOTO (JP)
OGAWA HIRONORI (JP)
TAKAHIRA ISAO (JP)

PCT/JP2013/082118

June 04, 2015

November 29, 2013

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HITACHI LTD (JP)

H05K13/04; H05K13/08

JP2003234598A	2003-08-22
JP4014476B2	2007-11-28
JP2012146907A	2012-08-02

INOUE Manabu et al. (JP)
Manabu Inoue (JP)

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