Title:
COMPONENT MOUNTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/225151
Kind Code:
A1
Abstract:
A component mounting device (1) is provided with: a component supply device (5) that supplies, using a component housing tape (100), a component (E) to a component supply position (P1); a head unit (6) that is provided with a suction nozzle (63) such that the suction nozzle can be raised/lowered; a first image pickup unit (91) that picks up an image of the component (E) supplied to the component supply position (P1); and a component attitude determining unit (13) that determines the attitude of the component (E) supplied to the component supply position (P1). On the basis of the image picked up by means of the first image pickup unit (91), the component attitude determining unit (13) determines whether the component (E) is, in the component housing tape (100), in an abnormal attitude wherein the component is protruding in the direction onto a horizontal plane from a component housing section (103), said horizontal plane intersecting the vertical direction (Z direction).
Inventors:
KOMAIKE KUNIMUNE (JP)
Application Number:
PCT/JP2017/020970
Publication Date:
December 13, 2018
Filing Date:
June 06, 2017
Export Citation:
Assignee:
YAMAHA MOTOR CO LTD (JP)
International Classes:
H05K13/08; H05K13/02
Foreign References:
| JP2015230912A | 2015-12-21 | |||
| JP2015090925A | 2015-05-11 |
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (JP)
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