Title:
COMPONENT-MOUNTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/021365
Kind Code:
A1
Abstract:
A component-mounting device (100) comprises: a head (3a) that holds a component (E) supplied from a component supply unit (11) and mounts said component on a substrate (P); a first image pick-up unit (7) that picks up a position identification mark (F) applied to the substrate; a second image pick-up unit (8) that is provided independently of the first image pick-up unit; and a control unit (9) that acquires the height of a measurement object (12) on the basis of a first image (13) of the measurement object picked up by the first image pick-up unit and a second image (14) of the measurement object picked up by the second image pick-up unit.
Inventors:
KOMAIKE KUNIMUNE (JP)
YAMAZUMI KOJI (JP)
IEIZUMI KAZUYOSHI (JP)
YAMAZUMI KOJI (JP)
IEIZUMI KAZUYOSHI (JP)
Application Number:
PCT/JP2017/026815
Publication Date:
January 31, 2019
Filing Date:
July 25, 2017
Export Citation:
Assignee:
YAMAHA MOTOR CO LTD (JP)
International Classes:
H05K13/08
Domestic Patent References:
| WO2012026073A1 | 2012-03-01 |
Foreign References:
| JPS6479874A | 1989-03-24 | |||
| JP2005244122A | 2005-09-08 | |||
| JPH0455708A | 1992-02-24 | |||
| JP2006024619A | 2006-01-26 | |||
| US20140198185A1 | 2014-07-17 |
Attorney, Agent or Firm:
MIYAZONO, Hirokazu (JP)
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