Title:
COMPONENT MOUNTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/064413
Kind Code:
A1
Abstract:
A component mounting device (100) is provided with: a head unit (4) that includes a mounting head (42) for mounting a component (31) on a substrate (P); and an image pickup unit (8), which is provided to the head unit, and which is capable of picking up, from a plurality of directions, images of a position where the mounting head sucks the component and/or a position where the mounting head mounts the component, said image pickup unit picking up a first image and a second image. The component mounting device is configured so as to expand/contract the first image in accordance with the image pickup direction of the second image, said first image having been picked up by means of the image pickup unit, and on the basis of the second image and the expanded/contracted first image, acquire the height position of the position where the images were picked up.
Inventors:
TAKAMA KAZUSHI (JP)
Application Number:
PCT/JP2017/035172
Publication Date:
April 04, 2019
Filing Date:
September 28, 2017
Export Citation:
Assignee:
YAMAHA MOTOR CO LTD (JP)
International Classes:
H05K13/08
Domestic Patent References:
| WO2017064776A1 | 2017-04-20 |
Foreign References:
| JP2001109879A | 2001-04-20 | |||
| US20140043033A1 | 2014-02-13 | |||
| US20140198185A1 | 2014-07-17 |
Attorney, Agent or Firm:
MIYAZONO, Hirokazu (JP)
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