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Title:
COMPONENT MOUNTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/150439
Kind Code:
A1
Abstract:
Provided is a component mounting device (100) including a mounting head (41) for mounting a component (E) on a work (W), and an engaging portion (310) provided on the mounting head and coming into engagement with an engaged portion (214) of a loading member (200) on which the work is loaded. The mounting head is configured to move the work together with the loading member while the engaging portion is engaged with the engaged portion.

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Inventors:
MORI DAICHI (JP)
KIBE YUZO (JP)
Application Number:
PCT/JP2018/003002
Publication Date:
August 08, 2019
Filing Date:
January 30, 2018
Export Citation:
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Assignee:
YAMAHA MOTOR CO LTD (JP)
International Classes:
H05K13/02
Domestic Patent References:
WO2017122282A12017-07-20
Foreign References:
JPH02284834A1990-11-22
JP2014220354A2014-11-20
JP2014220406A2014-11-20
JP2012156433A2012-08-16
Attorney, Agent or Firm:
MIYAZONO, Hirokazu (JP)
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