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Title:
COMPONENT MOUNTING MACHINE AND METHOD FOR DETERMINING DROPPING OF COMPONENT
Document Type and Number:
WIPO Patent Application WO/2019/058530
Kind Code:
A1
Abstract:
A component mounting machine is provided with a component supply device for supplying a component to a supply position and a component transfer device that uses a component mounting tool to pick up the component from the supply position and mount the component on a substrate. The component mounting machine is additionally provided with: a component detection unit that detects whether the component is present at the supply position either before the component is picked up using the component mounting tool or when picking up the component; a holding detection unit that detects whether the component mounting tool has picked up and is holding the component; a remaining component detection unit that detects whether the component remains at the supply position when it is detected by the holding detection unit that the component mounting tool is not holding the component; and a dropping determination unit that determines whether the component has dropped on the basis of the detection result of the component detection unit, the detection result of the holding detection unit, and the detection result of the remaining component detection unit.

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Inventors:
KITO RIE (JP)
KAWAI HIDETOSHI (JP)
HOSOI NORIO (JP)
NOZAWA MIZUHO (JP)
IISAKA JUN (JP)
ITO HIDETOSHI (JP)
FUJIMURA SHINGO (JP)
ISHIKAWA KENZO (JP)
YAMAKAGE YUSUKE (JP)
Application Number:
PCT/JP2017/034378
Publication Date:
March 28, 2019
Filing Date:
September 22, 2017
Export Citation:
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Assignee:
FUJI CORP (JP)
International Classes:
H05K13/02; H05K13/04; H05K13/08
Domestic Patent References:
WO2017013807A12017-01-26
Foreign References:
JP2008218706A2008-09-18
JPH1068759A1998-03-10
JPH09298395A1997-11-18
JP2003101300A2003-04-04
JP2008053382A2008-03-06
JP2010232544A2010-10-14
Other References:
See also references of EP 3687268A4
Attorney, Agent or Firm:
KOBAYASHI Osamu et al. (JP)
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