Title:
COMPONENT MOUNTING MACHINE
Document Type and Number:
WIPO Patent Application WO/2019/064440
Kind Code:
A1
Abstract:
This component mounting machine is provided with: a head that has a plurality of nozzles capable of sucking components at suction ports; a negative pressure supply device that has a negative pressure source for generating negative pressure and that is capable of supplying negative pressure from the negative pressure source individually to the suction ports of the plurality of nozzles; a lifting and lowering device capable of individually lifting and lowering the plurality of nozzles; and a control device that allows executions of a first suction operation of lowering one of the nozzles, supplying negative pressure to the suction port of the one nozzle, and sucking a component at the suction port of the one nozzle, and a second suction operation of simultaneously lowering the plurality of nozzles, supplying negative pressure to the suction ports of the plurality of nozzles, and simultaneously sucking components at the suction ports of the plurality of nozzles. In the case where the absolute value of negative pressure from the negative pressure source is not less than a first threshold value, the control device executes the second suction operation. In the case where the absolute value of negative pressure from the negative pressure source is less than the first threshold value and is not less than a second threshold value lower than the first threshold value, the control device executes the first suction operation. In the case where the absolute value of negative pressure from the negative pressure source is less than the second threshold value, the control device does not execute the suction operation.
More Like This:
Inventors:
OYAMA SHIGETO (JP)
IISAKA JUN (JP)
IISAKA JUN (JP)
Application Number:
PCT/JP2017/035256
Publication Date:
April 04, 2019
Filing Date:
September 28, 2017
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/04
Domestic Patent References:
| WO2017056292A1 | 2017-04-06 |
Foreign References:
| JP2007281432A | 2007-10-25 | |||
| JP2011044501A | 2011-03-03 | |||
| JP2003023294A | 2003-01-24 | |||
| JP2008227402A | 2008-09-25 | |||
| JP2008172021A | 2008-07-24 | |||
| JP2004527924A | 2004-09-09 |
Other References:
See also references of EP 3691431A4
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
Download PDF: