Title:
COMPONENT MOUNTING MACHINE
Document Type and Number:
WIPO Patent Application WO/2019/116540
Kind Code:
A1
Abstract:
This component mounting machine comprises: a component transfer device having a component mounting tool, a mounting head, and a head driving mechanism, wherein the component transfer device performs a mounting operation whereby a component collected from a component supplying device is mounted at a predetermined coordinate position on a board which has been sent-in and positioned by a board transport device; and a control device for controlling the mounting operation while performing heat correction processing for mitigating the influence of thermal deformation on component mounting accuracy accompanying a temperature change in at least one among the head driving mechanism and the mounting head. The control device comprises: a performance period determination unit for determining the performance period for the heat correction processing, on the basis of whether the level of the mounting accuracy required is high or low, or, taking into consideration a period of change during which the performance status of the mounting operation changes and during which the mounting accuracy may change; and a heat correction performing unit for performing the heat correction processing according to the result of the determination from the performance period determination unit.
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Inventors:
OYAMA SHIGETO (JP)
IISAKA JUN (JP)
ONISHI MICHINAGA (JP)
IISAKA JUN (JP)
ONISHI MICHINAGA (JP)
Application Number:
PCT/JP2017/045119
Publication Date:
June 20, 2019
Filing Date:
December 15, 2017
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/04
Domestic Patent References:
| WO2016103413A1 | 2016-06-30 | |||
| WO2009068605A1 | 2009-06-04 | |||
| WO2016103413A1 | 2016-06-30 |
Foreign References:
| JP2004179636A | 2004-06-24 | |||
| JP2007235018A | 2007-09-13 | |||
| JP2009010177A | 2009-01-15 | |||
| JP4418014B2 | 2010-02-17 |
Other References:
See also references of EP 3726950A4
Attorney, Agent or Firm:
KOBAYASHI Osamu et al. (JP)
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