Title:
COMPONENT MOUNTING METHOD AND APPARATUS
Document Type and Number:
WIPO Patent Application WO2000025564
Kind Code:
A3
Abstract:
The component handling tool (14) is moved linearly up and down on a moving mechanism (11) by feedback control of a linear motor (16) for performing pickup and mounting actions of components (3). The linear motor is controlled to effect a downward movement of the component handling tool for bringing the component handling tool or the component held thereby closer to the component or to a mounting object, and upon detecting changes in control information when contact is made with the component or the mounting object, control of the linear motor is switched to a pressing operation, whereby the holding or mounting of the component in a prescribed pressed condition is accomplished.
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Inventors:
NAKAO OSAMU (JP)
YOSHIDA NORIAKI (JP)
TAKEDA TAKESHI (JP)
YOSHIDA NORIAKI (JP)
TAKEDA TAKESHI (JP)
Application Number:
PCT/JP1999/005893
Publication Date:
August 10, 2000
Filing Date:
October 25, 1999
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD (JP)
NAKAO OSAMU (JP)
YOSHIDA NORIAKI (JP)
TAKEDA TAKESHI (JP)
NAKAO OSAMU (JP)
YOSHIDA NORIAKI (JP)
TAKEDA TAKESHI (JP)
International Classes:
H05K13/04; (IPC1-7): H05K13/04
Foreign References:
US4944086A | 1990-07-31 | |||
US5285946A | 1994-02-15 |
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