Title:
COMPONENT MOUNTING METHOD AND COMPONENT MOUNTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/021892
Kind Code:
A1
Abstract:
The invention addresses the problem of providing a component mounting method and component mounting device that even when having a press process, are resistant to falling component attachment precision. The component mounting method executes an attachment process multiple times, said attachment process attaching a component (C) to a board (Bf). The component mounting method is characterized by executing a press process that presses the attached component (C), and a check process that checks for position drift of the board (Bf) caused by the pressing of the component (C), after the Nth (where N is a natural number) attachment process and before the (N + 1)th attachment process.
Inventors:
KUBOTA TOMOKATSU (JP)
Application Number:
PCT/JP2012/069580
Publication Date:
February 14, 2013
Filing Date:
August 01, 2012
Export Citation:
Assignee:
FUJI MACHINE MFG (JP)
KUBOTA TOMOKATSU (JP)
KUBOTA TOMOKATSU (JP)
International Classes:
H05K13/04; H05K13/08
Foreign References:
| JP2002205224A | 2002-07-23 | |||
| JP2005123636A | 2005-05-12 | |||
| JP2004103650A | 2004-04-02 |
Attorney, Agent or Firm:
HIGASHIGUCHI Michiaki et al. (JP)
Michiaki Higashiguchi (JP)
Michiaki Higashiguchi (JP)
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Claims: