Title:
COMPONENT MOUNTING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/105030
Kind Code:
A1
Abstract:
This component mounting method uses a component mounting machine (1) that is provided with: a mounting head (33); a component camera (41) as an image pickup device for picking up images of components; and a first component holding unit (35) capable of holding a first component (P1), and a second component holding unit (36) capable of holding, at a lower position than the first component (P1), second components (P21, P22), said first component holding unit and second component holding unit being provided to the mounting head (33). The component mounting method includes: a step in which the first component holding unit (35) picks up the first component (P1); a step in which the image pickup device picks up an image of the first component (P1); a step in which the second component holding unit (36) picks up the second components (P21, P22) in a state wherein the first component holding unit (35) is holding the first component (P1); and a step in which the image pickup device picks up images of the second components (P21, P22) in a state wherein the first component holding unit (35) is holding the first component (P1), and the second component holding unit (36) is holding the second components (P21, P22).
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Inventors:
KUNO KOUSHI (JP)
Application Number:
PCT/JP2016/086147
Publication Date:
June 14, 2018
Filing Date:
December 06, 2016
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/08; H05K13/04
Foreign References:
| JP2009170524A | 2009-07-30 | |||
| JP2001308591A | 2001-11-02 | |||
| JP2001135996A | 2001-05-18 | |||
| JP2008091815A | 2008-04-17 | |||
| JP2004304120A | 2004-10-28 |
Other References:
See also references of EP 3554206A4
Attorney, Agent or Firm:
KOBAYASHI Osamu et al. (JP)
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