Title:
COMPONENT MOUNTING SYSTEM AND COMPONENT MOUNTING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/150573
Kind Code:
A1
Abstract:
A component mounting system, when holding and then mounting an electronic component, including a to-be-positioned object on the upper surface of the electronic component, on a board is to perform an alignment in such a manner that the to-be-positioned object is aligned to a predetermined position on the board. The component mounting system detects a misregistration of the to-be-positioned object on the upper surface of the electronic component and executes a placement operation in which a placement position is modified in accordance with the detected misregistration, thereby placing a positioning material on the board. Further, the component mounting system executes a mounting operation in which the to-be-positioned object is aligned to the predetermined position on the board at which the positioning material is placed, thereby mounting the electronic component on the board.
Inventors:
SAKURAYAMA TAKESHI (JP)
NIWA KOTA (JP)
NIWA KOTA (JP)
Application Number:
PCT/JP2017/006129
Publication Date:
August 23, 2018
Filing Date:
February 20, 2017
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/04
Foreign References:
| JP2015119134A | 2015-06-25 | |||
| JP2010251579A | 2010-11-04 | |||
| JP2004111424A | 2004-04-08 | |||
| JP2015126216A | 2015-07-06 | |||
| JP2016181723A | 2016-10-13 |
Other References:
See also references of EP 3585141A4
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
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