Title:
COMPONENT MOUNTING SYSTEM, RESIN SHAPING DEVICE, COMPONENT MOUNTING METHOD, AND RESIN SHAPING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/147037
Kind Code:
A1
Abstract:
A chip mounting system (1) is equipped with: a chip supplying unit (11) for supplying a chip (CP); a stage (31) for holding a substrate (WT) at an orientation in which a mounting surface (WTf) to which the chip (CP) is mounted on the substrate (WT) faces vertically downward (-Z direction); a head (33H) for holding the chip (CP) from vertically therebelow (-Z direction); and a head driving unit (36) for mounting the chip (CP) to the mounting surface (WTf) of the substrate (WT) by moving the head (33H) holding the chip (CP) vertically upward (+Z direction) to bring the head (33H) close to the stage (31).
Inventors:
YAMAUCHI AKIRA (JP)
Application Number:
PCT/JP2018/001467
Publication Date:
August 16, 2018
Filing Date:
January 18, 2018
Export Citation:
Assignee:
BONDTECH CO LTD (JP)
International Classes:
H01L21/60; B29C35/08; H01L21/027; H01L21/677; H05K13/04; B81C1/00
Domestic Patent References:
| WO2008126312A1 | 2008-10-23 |
Foreign References:
| JP2010076300A | 2010-04-08 | |||
| JP2013038365A | 2013-02-21 | |||
| JP2016127167A | 2016-07-11 | |||
| JP2010080763A | 2010-04-08 |
Attorney, Agent or Firm:
KIMURA Mitsuru (JP)
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