Title:
COMPONENT MOUNTING SYSTEM AND TAPE SCRAPS COLLECTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/202810
Kind Code:
A1
Abstract:
A component mounting system provided with: a component mounting device group in which a plurality of component mounting devices are arrayed in a substrate transfer direction on a floor surface, wherein the plurality of component mounting devices mount a component being supplied by means of a tape feeder onto a substrate being loaded from an upstream side, unload the substrate on a downstream side, cut a carrier tape, from which the component has been supplied, using a cutter device, and eject scraps of the carrier tape; a main conveyor which is installed in a region on the floor surface under the component mounting device group and along the direction in which the plurality of component mounting devices are arrayed, and which transfers the scraps of the carrier tape ejected from each of the plurality of component mounting devices; and a scraps container unit which is installed outside the region and in which the scraps of the carrier tape transferred by the main conveyor are contained.
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Inventors:
KOBAYASHI HIROKI
AZUMA NAOKI
TAKATA CHIKARA
ASANO YUZO
CHIKUMA TORU
SATOU HIROSHI
AZUMA NAOKI
TAKATA CHIKARA
ASANO YUZO
CHIKUMA TORU
SATOU HIROSHI
Application Number:
PCT/JP2019/003293
Publication Date:
October 24, 2019
Filing Date:
January 31, 2019
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H05K13/02; B65B15/04; B65G47/68
Domestic Patent References:
| WO2015045018A1 | 2015-04-02 | |||
| WO2015198437A1 | 2015-12-30 |
Foreign References:
| JP2000013095A | 2000-01-14 | |||
| JP2013175618A | 2013-09-05 | |||
| JP2011071257A | 2011-04-07 |
Attorney, Agent or Firm:
KAMATA Kenji et al. (JP)
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