Title:
COMPONENT MOUNTING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/007742
Kind Code:
A1
Abstract:
This component mounting system (100) comprises: a component mounting device (14) that is provided in a mounting area (AR1) and mounts a component on a substrate (S); a robot (20) that conveys component units (60, 70) that can hold a component; and an arrangement unit (30) that is provided in a work area (AR2) in which a worker (W) works, and is capable of arranging a plurality of component units to be conveyed by the robot, the work area (AR2) being separate from the mounting area.
Inventors:
YANAGIDA TSUTOMU (JP)
OKAMOTO YOSHINORI (JP)
KOBAYASHI YUSUKE (JP)
FUJII NAOYA (JP)
MATSUSHITA YOICHI (JP)
AMANAI SHIN (JP)
OKAMOTO YOSHINORI (JP)
KOBAYASHI YUSUKE (JP)
FUJII NAOYA (JP)
MATSUSHITA YOICHI (JP)
AMANAI SHIN (JP)
Application Number:
PCT/JP2021/028479
Publication Date:
February 02, 2023
Filing Date:
July 30, 2021
Export Citation:
Assignee:
YAMAHA MOTOR CO LTD (JP)
International Classes:
H05K13/00
Domestic Patent References:
| WO2020217861A1 | 2020-10-29 | |||
| WO2021144863A1 | 2021-07-22 | |||
| WO2019187033A1 | 2019-10-03 | |||
| WO2019229881A1 | 2019-12-05 | |||
| WO2020240681A1 | 2020-12-03 |
Foreign References:
| JP2020014019A | 2020-01-23 |
Attorney, Agent or Firm:
MIYAZONO, Hirokazu (JP)
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