Title:
COMPONENT TRANSFER DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/158855
Kind Code:
A1
Abstract:
Provided is a component transfer device comprising: a component mounting tool that is fit to a movable mounting head and that collects a component from a component supply device and mounts the component on a substrate; a side imaging part that images, from the side, the component held by the component mounting tool; a cleaning nozzle having, only on the side surface thereof, a blowout opening that opens towards the side imaging part; and a positive pressure air supply part that supplies positive pressure air to the cleaning nozzle and that causes the positive pressure air to blow out from the blowout opening towards the side imaging part.
Inventors:
TESHIMA CHIKASHI (JP)
HATTORI KAZUMA (JP)
HATTORI KAZUMA (JP)
Application Number:
PCT/JP2017/007972
Publication Date:
September 07, 2018
Filing Date:
February 28, 2017
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/04; H05K13/08
Domestic Patent References:
| WO2014207907A1 | 2014-12-31 |
Foreign References:
| JP2012235056A | 2012-11-29 | |||
| JP2001267796A | 2001-09-28 | |||
| US20120218402A1 | 2012-08-30 | |||
| JP2001267796A | 2001-09-28 |
Other References:
See also references of EP 3592126A4
Attorney, Agent or Firm:
KOBAYASHI Osamu et al. (JP)
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