Title:
COMPONENT WITH IMPROVED HEAT DISSIPATION
Document Type and Number:
WIPO Patent Application WO/2017/008981
Kind Code:
A1
Abstract:
In the case of a component with component structures that generate heat loss on an active side of the substrate, it is proposed to apply a heat conductor on the rear face of the component substrate, said rear face having a second coefficient of thermal conductivity αLS that is substantially higher than the first coefficient of thermal conductivity αS of the substrate. The heat dissipation then occurs across the heat conductor and across connecting means that connect the substrate to a carrier.
Inventors:
JEWULA TOMASZ (DE)
MEISTER VEIT (DE)
MEISTER VEIT (DE)
Application Number:
PCT/EP2016/063748
Publication Date:
January 19, 2017
Filing Date:
June 15, 2016
Export Citation:
Assignee:
EPCOS AG (DE)
International Classes:
H03H9/02
Domestic Patent References:
| WO2014029602A1 | 2014-02-27 |
Foreign References:
| US20040237299A1 | 2004-12-02 | |||
| US20050167854A1 | 2005-08-04 | |||
| EP1139412A1 | 2001-10-04 | |||
| US7940146B2 | 2011-05-10 | |||
| US7940146B2 | 2011-05-10 |
Other References:
NISHIZAWA T ET AL: "Realization of small and low profile Duplexer using a CSSD packaging technology", ULTRASONICS SYMPOSIUM (IUS), 2009 IEEE INTERNATIONAL, IEEE, PISCATAWAY, NJ, USA, 20 September 2009 (2009-09-20), pages 903 - 906, XP031654547, ISBN: 978-1-4244-4389-5
T. SUZUKI ET AL: "Analysis of heat dissipation improvement using bonded wafer in Chip Size SAW Device structure", 2013 IEEE INTERNATIONAL ULTRASONICS SYMPOSIUM (IUS), 1 July 2013 (2013-07-01), pages 1961 - 1964, XP055297468, ISBN: 978-1-4673-5684-8, DOI: 10.1109/ULTSYM.2013.0500
T.NISHIZAWA; G.ENDO; M.TAJIMA; S.ONO; O.KAWACHI: "Realization of Small and Low Profile Duplexer Using A CSSD Packaging Technology", IEEE ULTRASONICS SYMPOSIUM, 2009, pages 903 - 906
T.SUZUKI; T.NISHIZAWA; O.KAWACHI: "Analysis of Heat Dissipation Improvement using Bonded Wafer in Chip Size SAW Device Structure", IEEE JOINT UFFC, EFTF AND PFM SYMPOSIUM, 2013, pages 1961 - 1964
T. SUZUKI ET AL: "Analysis of heat dissipation improvement using bonded wafer in Chip Size SAW Device structure", 2013 IEEE INTERNATIONAL ULTRASONICS SYMPOSIUM (IUS), 1 July 2013 (2013-07-01), pages 1961 - 1964, XP055297468, ISBN: 978-1-4673-5684-8, DOI: 10.1109/ULTSYM.2013.0500
T.NISHIZAWA; G.ENDO; M.TAJIMA; S.ONO; O.KAWACHI: "Realization of Small and Low Profile Duplexer Using A CSSD Packaging Technology", IEEE ULTRASONICS SYMPOSIUM, 2009, pages 903 - 906
T.SUZUKI; T.NISHIZAWA; O.KAWACHI: "Analysis of Heat Dissipation Improvement using Bonded Wafer in Chip Size SAW Device Structure", IEEE JOINT UFFC, EFTF AND PFM SYMPOSIUM, 2013, pages 1961 - 1964
Attorney, Agent or Firm:
EPPING HERMANN FISCHER PATENTANWALTSGESELLSCHAFT MBH (DE)
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