Title:
COMPOSITE CHIP COMPONENT, CIRCUIT ASSEMBLY AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2014/162987
Kind Code:
A1
Abstract:
This composite chip component includes: a plurality of chip elements which are disposed so as to be mutually spaced apart upon a common substrate, and which have mutually different functions; and a pair of electrodes which, in each of the chip elements, are formed on the surface of the substrate. As a result, it is possible to reduce the bond area (footprint) for the mounting substrate, and therefore, it is possible to provide a composite chip component capable of achieving efficiency of mounting operation.
Inventors:
TAMAGAWA HIROSHI (JP)
NIINO KOICHI (JP)
NUKAGA EIJI (JP)
WATANABE KEISHI (JP)
NIINO KOICHI (JP)
NUKAGA EIJI (JP)
WATANABE KEISHI (JP)
Application Number:
PCT/JP2014/058995
Publication Date:
October 09, 2014
Filing Date:
March 27, 2014
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01G4/228; H01C13/02; H01G4/40
Domestic Patent References:
| WO2006085492A1 | 2006-08-17 |
Foreign References:
| JP2008270447A | 2008-11-06 | |||
| JP2012004180A | 2012-01-05 | |||
| JPH10135016A | 1998-05-22 |
Attorney, Agent or Firm:
INAOKA, Kosaku et al. (JP)
Kosaku Inaoka (JP)
Kosaku Inaoka (JP)
Download PDF: