Title:
COMPOSITE COMPONENT AND STRUCTURE FOR MOUNTING SAME
Document Type and Number:
WIPO Patent Application WO/2018/105201
Kind Code:
A1
Abstract:
Provided is a composite component which has a semiconductor device and an acoustic wave device stacked therein and which has excellent heat dissipation. In a composite component 3: a semiconductor device 21 is stacked on an acoustic wave device 11; lateral surface electrodes 6, 7 each extend from at least one of a plurality of lateral surfaces 12c, 12d of a piezoelectric substrate 12 in the acoustic wave device 11 to at least one of a plurality of lateral surfaces 22c, 22d of a semiconductor substrate 22 in the semiconductor device 21, and are connected to IDT electrodes 13 and functional electrodes 23a to 23c; and the lateral surface electrodes 6, 7 each extend to at least either a second main surface 12b of the piezoelectric substrate 12 or a second main surface 22b of the semiconductor substrate 22.
Inventors:
MATSUMOTO KATSUYA (JP)
TOYOTA YUJI (JP)
TOYOTA YUJI (JP)
Application Number:
PCT/JP2017/034528
Publication Date:
June 14, 2018
Filing Date:
September 25, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25; H01L25/00
Domestic Patent References:
| WO2014054362A1 | 2014-04-10 | |||
| WO2009157208A1 | 2009-12-30 | |||
| WO2015151705A1 | 2015-10-08 |
Foreign References:
| JP2011524647A | 2011-09-01 | |||
| JP2012520567A | 2012-09-06 | |||
| JP2004006564A | 2004-01-08 | |||
| JP2007116628A | 2007-05-10 | |||
| JP2007142105A | 2007-06-07 | |||
| JP2008546207A | 2008-12-18 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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