COMPOSITE CONDUCTIVE FILLER PARTICLES, CONDUCTIVE RESIN COMPOSITION, AND CONDUCTIVE RESIN MOLDED ARTICLE

Title:

COMPOSITE CONDUCTIVE FILLER PARTICLES, CONDUCTIVE RESIN COMPOSITION, AND CONDUCTIVE RESIN MOLDED ARTICLE

Document Type and Number:

WIPO Patent Application WO/2024/048654

Kind Code:

A1

Abstract:

Provided are: composite conductive filler particles 10 having graphite particles 2 and amorphous carbon 1 with which the graphite particles are coated; a conductive resin composition 20 having a resin material 3 and the composite conductive filler particles 10 dispersed in the resin material 3; and a conductive resin composition molded article formed by molding the conductive resin composition 20.

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Inventors:

KUBO RYOTA (JP)
YAMADA KUNITAKA (JP)
NONOGAKI AKIHIRO (JP)

Application Number:

PCT/JP2023/031543

Publication Date:

March 07, 2024

Filing Date:

August 30, 2023

Export Citation:

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Assignee:

MITSUBISHI PENCIL CO (JP)

International Classes:

C08K9/00; B29C43/18; C01B32/21; C08K3/04; C08L101/00; C09C1/44; C09C3/06; H01B1/24; H01M8/0213; H01M8/0221; H01M8/0226

Domestic Patent References:

WO2020213627A1

2020-10-22

Foreign References:

JP2006077214A	2006-03-23
JP2001015131A	2001-01-19
JP2005060204A	2005-03-10
JP2009004304A	2009-01-08

Attorney, Agent or Firm:

AOKI, Atsushi et al. (JP)

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