COMPOSITE COPPER FOIL AND METHOD FOR PRODUCING SAME

WIPO Patent Application WO/2012/132574

A1

Provided is a composite copper foil formed from copper/nickel/copper, which is characterized in comprising rolled copper foil or electrolytic copper foil (A) having a thickness of 10 to 150 µm, a nickel layer (B) having a thickness of 0.5 to 3 µm formed on one or both surfaces of the foil (A), and a copper layer (C) having a thickness of 1 to 12 µm formed on the nickel layer (B) without an oxide layer inserted between the nickel layer (B) and the copper layer (C). The problem is to obtain a composite copper foil ideal for the production of an electronic circuit by etching and a method for producing the same with which, when a composite copper foil formed from copper/nickel/copper is produced, the bond strength between the nickel and copper is improved.

WO/2005/010241	SURFACE-TREATED COPPER FOIL HAVING BLACKENING-TREATED SURFACE, PROCESS FOR PRODUCING THE SURFACE-TREATED COPPER FOIL AND, USING THE SURFACE-TREATED COPPER FOIL, ELECTROMAGNETIC WAVE SHIELDING CONDUCTIVE MESH FOR FRONT PANEL OF PLASMA DISPLAY
JP2538591	INDUSTRIAL APPLICABILITY: Strip electrolytic treatment method and apparatus

YAMANISHI KEISUKE (JP)
KAMINAGA KENGO (JP)
FUKUCHI RYO (JP)

PCT/JP2012/053104

October 04, 2012

February 10, 2012

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JX NIPPON MINING & METALS CORP (JP)
YAMANISHI KEISUKE (JP)
KAMINAGA KENGO (JP)
FUKUCHI RYO (JP)

C25D7/06; B32B15/01; C23C28/00; C25D1/04; C25D5/12; H05K1/09

JP2005260250A	2005-09-22
JPH08181432A	1996-07-12
JP2006207032A	2006-08-10

OGOSHI ISAMU (JP)
Isamu Ogoshi (JP)

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