Title:
COMPOSITE COPPER FOIL WITH COPPER OR COPPER ALLOY SUPPORT BODY, AND PRINTED CIRCUIT BOARD USING THE COMPOSITE COPPER FOIL
Document Type and Number:
WIPO Patent Application WO/2002/100136
Kind Code:
A1
Abstract:
A composite copper foil having a copper or copper alloy support body, characterized by comprising a nickel layer covered with oxide film between the copper or copper alloy support body and a very thin copper foil on the support body side, and a printed circuit board using the composite copper foil, whereby the easiness of handling of the very thin copper foil can be improved, contaminants such as resin powder of a prepreg sheet can be prevented from adhering to the surface of the copper foil, damage and dents by foreign matter can be effectively prevented from occurring, and damage, entry of foreign matter, wrinkles, and bending during normal cutting, packaging, and transportation can be prevented from occurring.
Inventors:
MICHISHITA NAONORI (JP)
HANAFUSA MIKIO (JP)
HANAFUSA MIKIO (JP)
Application Number:
PCT/JP2002/005179
Publication Date:
December 12, 2002
Filing Date:
May 29, 2002
Export Citation:
Assignee:
NIKKO MATERIALS CO LTD (JP)
MICHISHITA NAONORI (JP)
HANAFUSA MIKIO (JP)
MICHISHITA NAONORI (JP)
HANAFUSA MIKIO (JP)
International Classes:
H05K1/09; C25D1/04; C25D1/20; C25D7/06; H05K3/02; (IPC1-7): H05K1/09; C25D7/06
Foreign References:
| US3998601A | 1976-12-21 | |||
| JP2000269637A | 2000-09-29 |
Attorney, Agent or Firm:
Ogoshi, Isamu (Toranomon 9 Mori Bldg. 3F 2-2, Atago 1-Chom, Minato-ku Tokyo, JP)
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