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Title:
COMPOSITE COPPER MEMBER
Document Type and Number:
WIPO Patent Application WO/2020/226160
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a novel composite copper member. Provided by the present invention is a composite copper member which has a metal layer comprising metal other than copper formed on micro irregularities including copper and copper oxide on at least some of the surfaces of the copper member, wherein the surface of the composite copper member where the metal layer is formed has micro irregularities, the mean width of roughness profile elements (Rsm) of the surface of the composite copper member is 550 nm or less, the surface-area ratio is 1.3 to 2.2, and the average thickness of the metal layer in the vertical direction is 15 nm to 150 nm.

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Inventors:
SATO MAKIKO (JP)
KOKAJI YOSHINOBU (JP)
Application Number:
PCT/JP2020/018579
Publication Date:
November 12, 2020
Filing Date:
May 07, 2020
Export Citation:
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Assignee:
NAMICS CORP (JP)
International Classes:
C23C28/00; B32B15/01; C23C8/42; C23C22/63; C23C26/00; C25D5/16; C25D5/34; C25D7/06; H01B5/02; H01B13/00; H05K1/03; H05K1/09
Domestic Patent References:
WO2013147116A12013-10-03
Foreign References:
JP2013534054A2013-08-29
JPS61119699A1986-06-06
JPS5271348A1977-06-14
JPH0426780B21992-05-08
Attorney, Agent or Firm:
ISSHIKI & CO. (JP)
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