Title:
COMPOSITE COPPER NANOPARTICLES, AND METHOD FOR PRODUCING COMPOSITE COPPER NANOPARTICLES
Document Type and Number:
WIPO Patent Application WO/2023/002884
Kind Code:
A1
Abstract:
Provided are composite copper nanoparticles which has high dispersibility in an organic solvent, are rarely thermally shrunk when being sintered at 300°C or higher, and can be formed into a smooth electrode membrane. Composite copper nanoparticles are selected, in which the surface of each of copper nanoparticles is modified with a silane coupling agent, each of the copper nanoparticles has a coating film containing cuprous oxide and copper carbonate on at least a portion of the surface thereof, the mass carbon concentration is 0.5 to 1.5% by mass in which the whole concentration of the composite copper nanoparticles is 100% by mass, the mass carbon concentration associated with the silane coupling agent is 0.5 to 1.2% by mass in the above-mentioned mass carbon concentration, and the mass silicon concentration is 0.05 to 0.11% by mass in which the whole concentration of the composite copper nanoparticles is 100% by mass.
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Inventors:
TAKADA KATSUNORI (JP)
YAMAWAKI NAOYA (JP)
IGARASHI HIROSHI (JP)
SUZUKI NOBORU (JP)
YAMAWAKI NAOYA (JP)
IGARASHI HIROSHI (JP)
SUZUKI NOBORU (JP)
Application Number:
PCT/JP2022/027404
Publication Date:
January 26, 2023
Filing Date:
July 12, 2022
Export Citation:
Assignee:
TAIYO NIPPON SANSO CORP (JP)
International Classes:
B22F1/0545; B22F1/102; B22F9/20; H01B5/00
Domestic Patent References:
| WO2021100559A1 | 2021-05-27 |
Foreign References:
| JP6130616B1 | 2017-05-17 | |||
| JPH04190502A | 1992-07-08 | |||
| JPS57155386A | 1982-09-25 | |||
| JPH0215101A | 1990-01-18 |
Attorney, Agent or Firm:
SHIGA INTERNATIONAL PATENT OFFICE (JP)
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