Title:
COMPOSITE COPPER PARTICLES AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2015/019955
Kind Code:
A1
Abstract:
These composite copper particles comprise flat copper particles and a plurality of inorganic oxide particles being more minute than the flat copper particles. The inorganic oxide particles are uniformly distributed on the surface of the flat copper particles. Ideally, the volume cumulative particle diameter (D50) at the cumulative volume of 50% by volume, as determined by the laser diffraction/scattering particle size distribution measurement method, is 0.1-10 µm. In addition, the aspect ratio indicated by d/t, being the ratio between the major axis (d) of the plate surface and the thickness (t), is ideally 5-30.
Inventors:
KOHIRA TOSHIHIRO (JP)
SASAKI NOBUHIRO (JP)
MINOWA HIKARU (JP)
SASAKI NOBUHIRO (JP)
MINOWA HIKARU (JP)
Application Number:
PCT/JP2014/070334
Publication Date:
February 12, 2015
Filing Date:
August 01, 2014
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
B22F1/05; B22F1/068; B22F1/16; H01B1/22; H01B5/00; H01B13/00
Foreign References:
| JP2011006770A | 2011-01-13 | |||
| JP2000345201A | 2000-12-12 | |||
| JP2013019002A | 2013-01-31 | |||
| JPH0463124A | 1992-02-28 | |||
| JP2009072679A | 2009-04-09 | |||
| JP2003119501A | 2003-04-23 | |||
| JP2000345201A | 2000-12-12 | |||
| JP2005133119A | 2005-05-26 |
Attorney, Agent or Firm:
HATORI, Osamu et al. (JP)
Osamu Hatori (JP)
Osamu Hatori (JP)
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